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? semiconductor components industries, llc, 2013 april, 2013 ? rev. 27 1 publication order number: mc33269/d mc33269, ncv33269 800 ma, adjustable output, low dropout voltage regulator the mc33269/ncv33269 series are low dropout, medium current, fixed and adjustable, positive voltage regulators specifically designed for use in low input voltage applications. these devices offer the circuit designer an economical solution for precision voltage regulation, while keeping power losses to a minimum. the regulator consists of a 1.0 v dropout composite pnp ? npn pass transistor, current limiting, and thermal shutdown. features ? 3.3 v, 5.0 v, 12 v and adjustable versions 2.85 v version available as mc34268 ? space saving dpak, so ? 8 and sot ? 223 power packages ? 1.0 v dropout ? output current in excess of 800 ma ? thermal protection ? short circuit protection ? output trimmed to 1.0% tolerance ? ncv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable ? these are pb ? free devices device type/nominal output voltage mc33269d NCV33269D* mc33269dt NCV33269Dtrk* mc33269t mc33269d ? 3.3 mc33269dt ? 3.3 NCV33269Dtrk ? 3.3* mc33269t ? 3.3 mc33269st ? 3.3 adj adj adj adj 3.3 v 3.3 v 3.3 v 3.3 v 3.3 v mc33269d ? 5.0 mc33269dt ? 5.0 NCV33269Dt ? 5.0* NCV33269Dtrk ? 5.0* mc33269t ? 5.0 mc33269d ? 012 mc33269dt ? 012 NCV33269Dtrk ? 012* mc33269t ? 012 5.0 v 5.0 v 5.0 v 5.0 v 5.0 v 12 v 12 v 12 v 12 v *ncv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable. to ? 220ab t suffix case 221ab see detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. ordering information 1 8 7 6 5 1 2 3 4 gnd/adj so ? 8 d suffix case 751 dpak dt suffix case 369c v in nc nc 1. gnd/adj 2. v out 3. v in 1 (top view) v out v out heatsink surface (shown as terminal 4 in case outline drawing) is connected to pin 2. sot ? 223 st suffix case 318e 8 23 (top view) 1 3 1 3 (top view) 123 1 2 3 123 (top view) heatsink surface (shown as terminal 4 in case outline drawing) is connected to pin 2. see general marking information in the device marking section on page 8 of this data sheet. device marking information 1. gnd/adj 2. v out 3. v in http://onsemi.com
mc33269, ncv33269 http://onsemi.com 2 maximum ratings rating symbol value unit power supply input voltage v in 20 v power dissipation case 369c (dpak) t a = 25 ? c thermal resistance, junction ? to ? ambient thermal resistance, junction ? to ? case p d ja jc internally limited 92 6.0 w ? c/w ? c/w case 751 (so ? 8) t a = 25 ? c thermal resistance, junction ? to ? ambient thermal resistance, junction ? to ? case p d ja jc internally limited 160 25 w ? c/w ? c/w case 221a (to ? 220) t a = 25 ? c thermal resistance, junction ? to ? ambient thermal resistance, junction ? to ? case p d ja jc internally limited 65 5.0 w ? c/w ? c/w case 318e (sot ? 223) t a = 25 ? c thermal resistance, junction ? to ? ambient thermal resistance, junction ? to ? case p d ja jc internally limited 156 15 w ? c/w ? c/w operating die junction temperature range t j ? 40 to +150 ? c operating ambient temperature range mc33269 ncv33269 t a ? 40 to +125 ? 40 to +125 ? c storage temperature t stg ? 55 to +150 ? c electrostatic discharge sensitivity (esd) human body model (hbm) machine model (mm) esd 4000 400 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. electrical characteristics (c o = 10 f, t a = 25 ? c, for min/max values t a = ? 40 ? c to +125 ? c, unless otherwise noted.) characteristic symbol min typ max unit output voltage (i out = 10 ma, t a = 25 ? c) 3.3 suffix (v cc = 5.3 v) 5.0 suffix (v cc = 7.0 v) 12 suffix (v cc = 14 v) v o 3.27 4.95 11.88 3.3 5.0 12 3.33 5.05 12.12 v output voltage (line, load and temperature) (note 1) (1.25 v ? v in ? v out ? 15 v, i out = 500 ma) (1.35 v ? v in ? v out ? 10 v, i out = 800 ma) 3.3 suffix 5.0 suffix 12 suffix v o 3.23 4.9 11.76 3.3 5.0 12 3.37 5.1 12.24 v reference voltage for adjustable voltage (i out = 10 ma, v in ? v out = 2.0 v, t a = 25 ? c) v ref 1.235 1.25 1.265 v reference voltage (line, load and temperature) (note 1) for adjustable voltage (1.25 v ? v in ? v out ? 15 v, i out = 500 ma) (1.35 v ? v in ? v out ? 10 v, i out = 800 ma) v ref 1.225 1.25 1.275 v line regulation (i out = 10 ma, v in = [v out + 1.5 v] to v in = 20 v, t a = 25 ? c) reg line ? ? 0.3 % load regulation (v in = v out + 3.0 v, i out = 10 ma to 800 ma, t a = 25 ? c) reg load ? ? 0.5 % dropout voltage (i out = 500 ma) (i out = 800 ma) v in ? v out ? ? 1.0 1.1 1.25 1.35 v ripple rejection (10 v pp , 120 hz sinewave; i out = 500 ma) rr 55 ? ? db current limit (v in ? v out = 10 v) i limit 800 ? ? ma quiescent current (fixed output) (1.5 v ? v out ? 3.3 v) (5 v ? v out ? 12 v) i q ? ? 5.5 ? 8.0 20 ma minimum required load current fixed output voltage adjustable voltage i load ? 8.0 ? ? 0 ? ma adjustment pin current i adj ? ? 120 a 1. the mc33269 ? 12, v in ? v out is limited to 8.0 v maximum, because of the 20 v maximum rating applied to v in.
mc33269, ncv33269 http://onsemi.com 3 v in v out v adj gnd trim links this device contains 38 active transistors. figure 1. internal schematic
mc33269, ncv33269 http://onsemi.com 4 i o , output load current (ma) in v out -v figure 2. dropout voltage versus output load current 1.5 1.3 1.1 0.9 0.7 0.5 0 200 400 600 800 1000 figure 3. transient load regulation , dropout voltage (v) 20 ms/div c in = 10 f c o = 10 f tantalum v in = v o + 3.0 v preload = 0.1 a 0 a 0.5 a 100 , output i o v o , output ? voltage deviation current t a = 25 ? c t a = -40 ? c t a = 125 ? c mv/div -55 900 -25 0 25 50 75 100 125 940 980 1020 1060 1100 figure 4. dropout voltage versus temperature figure 5. mc33269 ? xx output dc current versus input ? output differential voltage v t a , ambient temperature ( ? c) i o = 800 ma , overvoltage input threshold (%v ) fb(ov) fb 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 2.0 4.0 6.0 8.0 10 12 14 16 input-output voltage differential (v) t a = 25 ? c mc33269d-xx l = 25 mm copper output current (a) 70 0.1 1.0 10 100 60 50 40 30 20 figure 6. mc33269 ripple rejection versus frequency figure 7. mc33269 ? adj ripple rejection versus frequency rr, ripple rejection ratio (db) f, frequency (khz) 20 30 40 50 60 70 rr, ripple rejection ratio (db) 100 10 1.0 f, frequency (khz) v in = 8.0 v v out = 5.0 v i l = 800 ma c adj = 22 f t a = 25 ? c 0.1 v in = v o + 3.0 v i l = 800 ma t a = 25 ? c v o = 12 v v o = 3.3 v or 5.0 v
mc33269, ncv33269 http://onsemi.com 5 ??? ??? ??? r , thermal resistance ja ? junction\to\air ( c/w) ? 40 80 120 160 200 240 280 0.35 0.42 0.50 0.63 0.83 1.25 2.50 0102030 25 15 5.0 l, length of copper (mm) p d(max) for t a = 50 ? c minimum size pad p d l l , maximum power dissipation (w) free air mounted vertically r ja 2.0 oz. copper ???? ???? ???? figure 8. sop ? 8 thermal resistance and maximum power dissipation versus p.c.b. copper length r , thermal resistance, ja ? junction-to-air ( c/w) ? r ja ??? ??? ??? ??? ? c 30 50 70 90 110 130 150 170 l, length of copper (mm) 0203050 40 10 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 r , thermal resistance, ja ? junction-to-air ( c/w) ? figure 9. dpak thermal resistance and maximum power dissipation versus p.c.b. copper length l ??? ??? ??? ??? ja minimum size pad free air mounted vertically p d(max) for t a = 50 ? c l 40 50 60 70 80 90 100 0102030 25 15 5.0 l, length of copper (mm) 0 0.4 0.8 1.2 1.6 2.0 2.4 figure 10. sot ? 223 thermal resistance and maximum power dissipation versus p.c.b. copper length
mc33269, ncv33269 http://onsemi.com 6 applications information figures 11 through 15 are typical application circuits. the output current capability of the regulator is in excess of 800 ma, with a typical dropout voltage of less than 1.0 v. internal protective features include current and thermal limiting. * the mc33269 requires an external output capacitor for stability. the capacitor should be at least 10 f with an equivalent series resistance (esr) of less than 10 but greater than 0.2 over the anticipated operating temperature range. w ith economical electrolytic capacitors, cold temperature operation can pose a problem. as temperature decreases, the capacitance also decreases and the esr increases, which could cause the circuit to oscillate. also capacitance and esr of a solid tantalum capacitor is more stable over temperature. the use of a low esr ceramic capacitor placed within close proximity to the output of the device could cause instability. ** an input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths. this will reduce the circuit?s sensitivity to the input line impedance at high frequencies. a 0.33 f or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. the bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator?s input terminals. applications should be tested over all operating conditions to insure stability. internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. when activated, typically at 170 ? c, the output is disabled. there is no hysteresis built into the thermal limiting circuit. as a result, if the device is overheating, the output will appear to be oscillating. this feature is provided to prevent catastrophic failures from accidental device overheating. it is not intended to be used as a substitute for proper heat ? sinking. figure 11. typical fixed output application mc33269-xx v in v out gnd c o 10 f an input capacitor is not necessary for stability, however it will improve the overall performance. figure 12. typical adjustable output application mc33269 v in v out adj c o 10 f c adj *** r1 r2 ***c adj is optional, however it will improve the ripple rejection. the mc34269 develops a 1.25 v reference voltage between the output and the adjust terminal. resistor r1, operates with constant current to flow through it and resistor r2. this current should be set such that the adjust pin current causes negligible drop across resistor r2. the total current with minimum load should be greater than 8.0 ma. figure 13. current regulator mc33269 v in i out adj r s i out figure 14. battery backed ? up power supply mc33269-xx v in v out mc33269-xx gnd c o 10 f figure 15. digitally controlled voltage regulator mc33269 v in v out adj c o 10 f r1 r2 r 2 sets the maximum output voltage. each transistor reduces the output voltage when turned on. the schottky diode in series with the ground leg of the upper regulator shifts its output voltage higher by the forward voltage drop of the diode. this will cause the lower device to remain off until the input voltage is removed. v out 1.25 1 r2 r1 i adj r2 1.25 r s c in c in c in c o 10 f c in c in gnd c in ** ** ** ** ** ** * * * * *
mc33269, ncv33269 http://onsemi.com 7 ordering information device package shipping information ? mc33269dg so ? 8 (pb ? free) 98 units / rail mc33269dr2g so ? 8 (pb ? free) 2500 units / tape & reel mc33269dtg dpak (pb ? free) 75 units / rail mc33269dtrkg dpak (pb ? free) 2500 units / tape & reel mc33269tg to ? 220 (pb ? free) 50 units / rail mc33269d ? 3.3g so ? 8 (pb ? free) 98 units / rail mc33269dr2 ? 3.3g so ? 8 (pb ? free) 2500 units / tape & reel mc33269dt ? 3.3g dpak (pb ? free) 75 units / rail mc33269dtrk ? 3.3g dpak (pb ? free) 2500 units / tape & reel mc33269st ? 3.3t3g sot ? 223 (pb ? free) 4000 units / tape & reel mc33269t ? 3.3g to ? 220 (pb ? free) 50 units / rail mc33269d ? 5.0g so ? 8 (pb ? free) 98 units / rail mc33269dr2 ? 5.0g so ? 8 (pb ? free) 2500 units / tape & reel mc33269dt ? 5.0g dpak (pb ? free) 75 units / rail NCV33269Dt ? 5.0g* dpak (pb ? free) 75 units / rail mc33269dtrk ? 5.0g dpak (pb ? free) 2500 units / tape & reel mc33269t ? 5.0g to ? 220 (pb ? free) 50 units / rail mc33269d ? 012g so ? 8 (pb ? free) 98 units / rail mc33269dr2 ? 012g so ? 8 (pb ? free) 2500 units / tape & reel mc33269dt ? 012g dpak (pb ? free) 75 units / rail mc33269dtrk ? 012g dpak (pb ? free) 2500 units / tape & reel mc33269t ? 012g to ? 220 (pb ? free) 50 units / rail NCV33269Dr2g* so ? 8 (pb ? free) 2500 units / tape & reel NCV33269Dtrkg* dpak (pb ? free) 2500 units / tape & reel NCV33269Dtrk3.3g* dpak (pb ? free) 2500 units / tape & reel NCV33269Dtrk5.0g* dpak (pb ? free) 2500 units / tape & reel NCV33269Dtrk ? 12g* dpak (pb ? free) 2500 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *ncv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable.
mc33269, ncv33269 http://onsemi.com 8 so ? 8 d suffix case 751 269aj alyw 1 8 1 8 269 ? 3 alyw 1 8 69 ? 12 alyw 269 ? 5 alyw 1 8 marking diagrams 1 2 3 269ajg alyww 1 2 3 69 ? 12g alyww 1 2 3 269 ? 3g alyww 1 2 3 269 ? 5g alyww dpak dt suffix case 369c to ? 220ab t suffix case 221a mc 33269t awlywwg mc 33269t ? 12 awlywwg mc 33269t ? 33 awlywwg mc 33269t ? 5 awlywwg sot ? 223 st suffix case 318e 1 ayw 2693 23 a = assembly location l, wl = wafer lot y = year w, ww = work week g = pb ? free package = pb ? free package (note: microdot may be in either location) 13 2 13 2 13 2 13 2
mc33269, ncv33269 http://onsemi.com 9 package dimensions so ? 8 d suffix case 751 ? 07 issue ak seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
mc33269, ncv33269 http://onsemi.com 10 package dimensions dpak dt suffix case 369c issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw
mc33269, ncv33269 http://onsemi.com 11 package dimensions sot ? 223 st suffix case 318e ? 04 issue n 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* a1 b1 d e b e e1 4 123 0.08 (0003) a l1 c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. h e dim a min nom max min millimeters 1.50 1.63 1.75 0.060 inches a1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 d 6.30 6.50 6.70 0.249 e 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 nom max l1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 h e ? ? e1 0 ? 1 0 ? 0 ? 1 0 ? l l 0.20 ??? ??? 0.008 ??? ???
mc33269, ncv33269 http://onsemi.com 12 package dimensions to ? 220, single gauge t suffix case 221ab issue a notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inches. 3. dimension z defines a zone where all body and lead irregularities are allowed. 4. product shipped prior to 2008 had dimensions s = 0.045 - 0.055 inches (1.143 - 1.397 mm) dim min max min max millimeters inches a 0.570 0.620 14.48 15.75 b 0.380 0.405 9.66 10.28 c 0.160 0.190 4.07 4.82 d 0.025 0.035 0.64 0.88 f 0.142 0.147 3.61 3.73 g 0.095 0.105 2.42 2.66 h 0.110 0.155 2.80 3.93 j 0.018 0.025 0.46 0.64 k 0.500 0.562 12.70 14.27 l 0.045 0.060 1.15 1.52 n 0.190 0.210 4.83 5.33 q 0.100 0.120 2.54 3.04 r 0.080 0.110 2.04 2.79 s 0.020 0.024 0.508 0.61 t 0.235 0.255 5.97 6.47 u 0.000 0.050 0.00 1.27 v 0.045 --- 1.15 --- z --- 0.080 --- 2.04 b q h z l v g n a k f 123 4 d seating plane ? t ? c s t u r j on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mc33269/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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